Category: Conferences & EXPOs

OMAC to Demonstrate Automating On-Machine Measurement Using the Digital Thread

OMAC will give a demonstration of on-machine measurement at the Digital Manufacturing and Design Innovation Institute (DMDII) on Goose Island in Chicago, Illinois on May 23, 2017.  The demonstration will show how the digital thread enables more accurate, timely and automated on-machine measurement.

The Digital thread connects elements in manufacturing and provides an integrated view throughout the process. In OMAC’s demonstration, a product model with embedded tolerances will be machined and measured in multiple phases. At the end of each phase, coordinates on the part will be communicated in real time to CMM software. Standardized reports will describe how well the tolerances are being met. Future demonstrations will use the data for closed loop applications.

The demonstration will use STEP to define a product model, MTConnect to communicate on-machine touch points, and QIF to report metrology results. STEP is supported by nearly every CAD system, and has recently been updated to include tolerances that can be reasoned with by intelligent software. MTConnect is available for nearly every type of machine tool and for this demonstration has been extended to include touch probe results. QIF has been developed by the team responsible for DMIS as a next generation standard for metrology planning and reporting.

New digital twin software will be used to coordinate the machining and measurement. At the start of the demonstration the twin will be loaded with the product model. During the demonstration, it will virtually machine the product model from the data sent by MTConnect. The twin will transform measurements on the machine into part coordinates that can be evaluated by CMM software. The twin will enable remote visualization in smart phones and browsers, and in future demonstrations it will correct and optimize the machining operations.

OMAC and SESAM Hold Conference on Smart Packaging Automation Using PackML & OPC UA

March 15 & 16
Copenhagen, Denmark
Microsoft Development Center
Kanalvej 7, 2800 Kongens Lyngby, Denmark

Conference includes examples and presentations of end user PackML and OPC UA implementations. Automation suppliers will exhibit and discuss PackML and OPC UA tools and solutions for OEMs and End User companies.

Cost: 350 Euro for OMAC and SESAM members; 450 Euro for non-members

Registration: www.sesam-world.com/registration-omac

For more information, review the conference brochure.

OMAC to Exhibit at interpack

OMAC will exhibit at interpack for the first time. The OMAC booth will be located in Hall 12, Booth C04-13. The show runs May 4-10, 2017 in Düsseldorf, Germany.

OMAC will hold receptions in member booths belonging to Lenze and B&R Automation.  Receptions in the Lenze booth (Hall 6 booth E79) will be held on Thursday, May 4 and on Friday, May 5 beginning at 5:00 pm.

A reception in the B&R Automation booth (Hall 6 booth E62) will be held on May 8 beginning at 5:00 pm.