Category: Conferences & EXPOs

24 OMAC Members and Partners Exhibiting at PACK EXPO Las Vegas

Contact: Brent Meyer
brentmeyer@fuse.net
859.391.0130
For Immediate Release

24 OMAC Members and Partners Exhibiting at PACK EXPO Las Vegas

  • OMAC shares practical advice on implementing ISA-TR 88, also known as
PackML on Innovation Stage, Tuesday September 26, noon C-1041
  • Learn how OMAC, OPC Foundation and PLC Open are collaborating to advance automation, booths C-1241, C-1243, C-1244
  • Demos of the PackTag builder Monday September 25 and Wednesday September 27 at 10:00 am in the OMAC Booth, C-1241.

Reston, VA – Organization for Machine Automation and Control (OMAC) members are in the vanguard of creating more efficient manufacturing and packaging operations. At PACK EXPO Las Vegas, September 25-27, OMAC members and partners will be exhibiting automation technology and packaging machinery solutions, many of them including the ISA-TR88.00.02 automation standard commonly known as PackML. (See the list of OMAC Members exhibiting at PACK EXPO Las Vegas with their booth numbers below).

OMAC will be showcasing PackML and initiatives such as the PackML/OPC UA companion specification in its booth. Manufacturers and machine builders worldwide have implemented PackML on various control platforms to increase speed to production, ease packaging line integration and improve reliability. The OPC Foundation’s Unified Architecture (OPC UA) is an industrial interoperability framework, which delivers information modeling with integrated security, access rights, and all communication layers to provide plug and play machine-to-machine (M2M) communication inside factories. It is scalable across the plant floor and from sensor to IT enterprise and cloud services. OMAC, OPC Foundation and PLCopen, which are working closely together to advance automation standards, will exhibit adjacent to each other in booths C-1241 to C-1244.

OMAC members will be available to discuss productivity enhancements utilizing PackML, Pack Tags, and PackSpec guidelines. Nine OMAC technology providers will feature PackML/OPC UA demonstration blades. Technology providers participating include B&R Automation, Beckhoff, Bosch Rexroth, Festo, Lenze, LTI Motion, Mitsubishi Electric, SEW, and Siemens. Demonstrations of the PackTag builder also will take place on Monday September 25 and Wednesday September 27 at 10:00 am in OMAC’s booth C-1241.

On the Innovation Stage C-1041 on Tuesday, September 26 at noon, OMAC member representatives from P&G, Mettler Toledo and Church and Dwight will discuss benefits and implementation experiences with PackML and PackSpec 2.

OMAC and its Packaging Workgroup will hold meetings at PACK EXPO on Tuesday, September 26 beginning at 10:00 am in room N238 at the Convention Center. PACK EXPO attendees are welcome.

OMAC Members Exhibiting at PACK EXPO Las Vegas
ABB (C-5242)
B&R Industrial Automation (S-6163)
Beckhoff Automation LLC (S-6302)
Bosch Rexroth Group (C-5206)
Festo (C-5408)
Fox IV (S-6301)
GEA (C-5404)
Harro Höfliger (N-317-D)
KEBA AG (S-5908)
KEB America (S-6282)
Lenze Automation GmbH (S-6033)
Mettler Toledo (C-1814, N-306)
Omron Electronics LLC (C-4305)
PakTech (S-1509)
Pro Mach Inc. (C-3218, C-3225)
Robert Bosch GmbH (C-2800)
Rockwell Automation (N-116
Schneider Electric NA (S-6092, S-6167)
SEW Eurodrive (S-6182)
Siemens Industry, Inc. (C-5911)
SMC (S-6169)

Partner Organizations
OPC Foundation (C-1243)
OpX Leadership Network (S-6519)
PLCopen (C-1244)

About OMAC
The Organization for Machine Automation and Control (OMAC) helps manufacturers and suppliers work together to identify new and innovative ways to increase the effectiveness of their production operations. OMAC brings together leading End-User Manufacturers, OEM Machine Builders, System Integrators, Technology Providers, and Non-Profit / Government Agency organizations to address issues that confront global manufacturing today. OMAC’s two working groups, Packaging and Manufacturing, lead the way in producing industry consensus guidelines that help manufacturers reduce their delivery times, be more efficient with available resources, and increase profitability.  More information is available at www.omac.org.

Automation Standard Leader OMAC Features Efforts to Advance Industrial Internet of Things at PACK EXPO Las Vegas

Contact: Brent Meyer
859.391.0130
brentmeyer@fuse.net
For Immediate Release

Automation Standard Leader OMAC Features Efforts to Advance
Industrial Internet of Things at PACK EXPO Las Vegas

  • Visit OMAC at PACK EXPO Las Vegas, September 25-27, booth C-1241
  • Learn about improving productivity with ISA-TR88.00.02, also known as PackML
  • Get the latest on the PackML/OPCUA companion specification

Reston, VA – The Organization for Machine Automation and Control (OMAC) will be showcasing automation standard initiatives at PACK EXPO Las Vegas (September 25-27; Las Vegas Convention Center) that are helping to advance the Industrial Internet of Things and improve packaging efficiency. OMAC will be located in booth C-1241.

Featured OMAC Initiatives include the ISA-TR88.00.02 automation standard commonly known as PackML and the PackML/OPC UA companion specification which is helping to advance communication protocols among devices and machines. OMAC, OPC Foundation, and PLCopen, co-located in the Association Partner Pavilion, are working together to help advance communications protocols necessary for the Industrial Internet of Things (IIoT) to succeed. The three organizations are at the forefront of developing and promoting common standards to improve manufacturing efficiency, but until now have been working in parallel on different aspects of automation standardization.

Interoperability between devices and machines that use different protocols is a significant challenge in realizing the full potential offered by the Industrial Internet of Things. By collaborating on companion specifications to existing standards and protocols, OMAC is working to help advance the quality and efficiency of data sharing and communication at the machine and production line and up through the enterprise.

One of OMAC’s major initiatives has been the promotion of ISA-TR88/PackML. Manufacturers and machine builders worldwide have implemented PackML on various control platforms to increase speed to production, ease packaging line integration and improve reliability. The second generation is currently available. While PackML defines machine modes, states and tag naming conventions, it does not specify a communications protocol. The OPC Foundation’s Unified Architecture (OPC UA) is an industrial interoperability framework. It delivers information modeling with integrated security, access rights, and all communication layers to provide plug and play machine-to-machine (M2M) communication inside factories. It is scalable across the plant floor and from sensor to IT enterprise and cloud scenarios.

To take their efforts to the next level, OMAC and the OPC Foundation have developed a companion specification for ISA-TR88/PackML and OPC UA.

“A standard communication protocol, used consistently across the industry, is vital for realizing the full benefits of automation standards such as ISA-TR88, which then can be a valuable data source for smart factories and the IIoT,” says Dr. Bryan Griffen, OMAC Chairman and Nestlé Group Engineering Manager. “A companion specification between ISA TR88 and OPC UA fills this need. The opportunities to transform manufacturing as hardware and software solutions are integrated through consistently applied, standardized protocols are extraordinary. We’re pleased to be a part of those efforts worldwide.”

OMAC will present on the PACK EXPO Las Vegas Innovation Stage (C-1041) on Tuesday, September 26 at noon. The presentation is entitled: PackML and the Internet of Things — A Practical Approach to Line Productivity Through Standardized Machine-to-Machine Communication and will include speakers from end-user Church and Dwight, OEM Mettler-Toledo, and OMAC.

OMAC also will be participating in PACK EXPO’s Amazing Packaging Race, an educational competition for university students, which requires them to visit exhibitor booths and solve packaging problems.

OMAC members will be available at PACK EXPO Las Vegas to discuss development of the PackML/OPC UA Companion Spec and productivity enhancements from implementing PackML, Pack Tags, and PackSpec guidelines.
Registration, which includes access to both PACK EXPO Las Vegas and Healthcare Packaging EXPO, is $30 until Sept. 1, where after the price increases to $100. For more information and to register online, visit www.packexpolasvegas.com.

About OMAC
The Organization for Machine Automation and Control (OMAC) helps manufacturers and suppliers work together to identify new and innovative ways to increase the effectiveness of their production operations. OMAC brings together leading End-User Manufacturers, OEM Machine Builders, System Integrators, Technology Providers, and Non-Profit / Government Agency organizations to address issues that confront global manufacturing today. OMAC’s two working groups, Packaging and Manufacturing, lead the way in producing industry consensus guidelines that help manufacturers reduce their delivery times, be more efficient with available resources, and increase profitability.  More information is available at www.omac.org.

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Dr. Bryan Griffen Discusses Upcoming PackML Workshop

Monday, May 22, Chicago Marriott O’Hare

  • Half-day training includes PackML coding and programming workshops with Rockwell and Siemens experts
  • Additional sessions on implementing PackML and OPC UA Companion Specification

OMAC’s PackML Workshop takes place on May 22, 1:00 – 5:00 p.m. at the Chicago Marriott O’Hare in partnership with the Automation Conference 2017, produced by Automation World and PMMI Media Group. The Automation Conference follows the PackML Workshop on May 23-24 at the same location.

To register, visit https://www.theautomationconference.com.

Listen to interview with Dr. Griffen.