Category: Conferences & EXPOs

28 OMAC Members and Partners Exhibiting at interpack 2017


Contact: Brent Meyer
brentmeyer@fuse.net
859.391.0130

For Immediate Release

28 OMAC Members and Partners Exhibiting at interpack 2017


  • OMAC exhibits at interpack for first time, Hall 12 Booth CO4-13, May 4-10, Dusseldorf, Germany
  • OMAC features PackML/OPC UA companion spec

Reston, VA  – A growing number of end users, OEMs and technology suppliers for packaging machines are implementing PackML, ISA-TR88.00.02, an Organization for Machine Automation and Control (OMAC) standard.

OMAC members are in the vanguard of creating more efficient manufacturing and packaging operations. At interpack 2017, OMAC will be showcasing the ISA-TR88.00.02 automation standard commonly known as PackML and initiatives, such as the PackML/OPC UA companion specification among devices and machines, which adds data modeling features, secure communications, and standard IIOT methods for sharing data.

At Interpack 2017 in Dusseldorf 27 member companies will present their respective PackML solutions. OMAC itself is showcasing initiatives such as the PackML/OPC UA companion specification which is helping to advance communication protocols among devices and machines.

Manufacturers and machine builders worldwide have implemented PackML on various control platforms to increase speed to production, ease packaging line integration and improve reliability. The second generation is currently available. While PackML defines machine modes, states and tag naming conventions, the OPC Foundation’s Unified Architecture (OPC UA) is an industrial interoperability framework. It delivers information modeling with integrated security, access rights, and all communication layers to provide plug and play machine-to-machine (M2M) communication inside factories. It is scalable across the plant floor and from sensor to IT enterprise and cloud scenarios.

OMAC members will be available at Interpack in Hall 12 Booth CO4-13. OMAC will hold receptions in member booths belonging Lenze and B&R Automation. Receptions in the Lenze booth (Hall 6 booth E79) will be held on Thursday, May 4 and on Friday, May 5 beginning at 5:00 pm. A reception in the B&R Automation booth (Hall 6 booth E62) will be held on May 8 beginning at 5:00 pm.

About OMAC

The Organization for Machine Automation and Control (OMAC) helps manufacturers and suppliers work together to identify new and innovative ways to increase the effectiveness of their production operations. OMAC brings together leading End-User Manufacturers, OEM Machine Builders, System Integrators, Technology Providers, and Non-Profit / Government Agency organizations to address issues that confront global manufacturing today. OMAC’s two working groups, Packaging and Manufacturing, lead the way in producing industry consensus guidelines that help manufacturers reduce their delivery times, be more efficient with available resources, and increase profitability.  More information is available at www.omac.org.

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OMAC to Demonstrate Automating On-Machine Measurement Using the Digital Thread

OMAC will give a demonstration of on-machine measurement at the Digital Manufacturing and Design Innovation Institute (DMDII) on Goose Island in Chicago, Illinois on May 23, 2017.  The demonstration will show how the digital thread enables more accurate, timely and automated on-machine measurement.

The Digital thread connects elements in manufacturing and provides an integrated view throughout the process. In OMAC’s demonstration, a product model with embedded tolerances will be machined and measured in multiple phases. At the end of each phase, coordinates on the part will be communicated in real time to CMM software. Standardized reports will describe how well the tolerances are being met. Future demonstrations will use the data for closed loop applications.

The demonstration will use STEP to define a product model, MTConnect to communicate on-machine touch points, and QIF to report metrology results. STEP is supported by nearly every CAD system, and has recently been updated to include tolerances that can be reasoned with by intelligent software. MTConnect is available for nearly every type of machine tool and for this demonstration has been extended to include touch probe results. QIF has been developed by the team responsible for DMIS as a next generation standard for metrology planning and reporting.

New digital twin software will be used to coordinate the machining and measurement. At the start of the demonstration the twin will be loaded with the product model. During the demonstration, it will virtually machine the product model from the data sent by MTConnect. The twin will transform measurements on the machine into part coordinates that can be evaluated by CMM software. The twin will enable remote visualization in smart phones and browsers, and in future demonstrations it will correct and optimize the machining operations.

OMAC and SESAM Hold Conference on Smart Packaging Automation Using PackML & OPC UA

March 15 & 16
Copenhagen, Denmark
Microsoft Development Center
Kanalvej 7, 2800 Kongens Lyngby, Denmark

Conference includes examples and presentations of end user PackML and OPC UA implementations. Automation suppliers will exhibit and discuss PackML and OPC UA tools and solutions for OEMs and End User companies.

Cost: 350 Euro for OMAC and SESAM members; 450 Euro for non-members

Registration: www.sesam-world.com/registration-omac

For more information, review the conference brochure.