24 OMAC Members and Partners Exhibiting at PACK EXPO Las Vegas

Contact: Brent Meyer
For Immediate Release

24 OMAC Members and Partners Exhibiting at PACK EXPO Las Vegas

  • OMAC shares practical advice on implementing ISA-TR 88, also known as
PackML on Innovation Stage, Tuesday September 26, noon C-1041
  • Learn how OMAC, OPC Foundation and PLC Open are collaborating to advance automation, booths C-1241, C-1243, C-1244
  • Demos of the PackTag builder Monday September 25 and Wednesday September 27 at 10:00 am in the OMAC Booth, C-1241.

Reston, VA – Organization for Machine Automation and Control (OMAC) members are in the vanguard of creating more efficient manufacturing and packaging operations. At PACK EXPO Las Vegas, September 25-27, OMAC members and partners will be exhibiting automation technology and packaging machinery solutions, many of them including the ISA-TR88.00.02 automation standard commonly known as PackML. (See the list of OMAC Members exhibiting at PACK EXPO Las Vegas with their booth numbers below).

OMAC will be showcasing PackML and initiatives such as the PackML/OPC UA companion specification in its booth. Manufacturers and machine builders worldwide have implemented PackML on various control platforms to increase speed to production, ease packaging line integration and improve reliability. The OPC Foundation’s Unified Architecture (OPC UA) is an industrial interoperability framework, which delivers information modeling with integrated security, access rights, and all communication layers to provide plug and play machine-to-machine (M2M) communication inside factories. It is scalable across the plant floor and from sensor to IT enterprise and cloud services. OMAC, OPC Foundation and PLCopen, which are working closely together to advance automation standards, will exhibit adjacent to each other in booths C-1241 to C-1244.

OMAC members will be available to discuss productivity enhancements utilizing PackML, Pack Tags, and PackSpec guidelines. Nine OMAC technology providers will feature PackML/OPC UA demonstration blades. Technology providers participating include B&R Automation, Beckhoff, Bosch Rexroth, Festo, Lenze, LTI Motion, Mitsubishi Electric, SEW, and Siemens. Demonstrations of the PackTag builder also will take place on Monday September 25 and Wednesday September 27 at 10:00 am in OMAC’s booth C-1241.

On the Innovation Stage C-1041 on Tuesday, September 26 at noon, OMAC member representatives from P&G, Mettler Toledo and Church and Dwight will discuss benefits and implementation experiences with PackML and PackSpec 2.

OMAC and its Packaging Workgroup will hold meetings at PACK EXPO on Tuesday, September 26 beginning at 10:00 am in room N238 at the Convention Center. PACK EXPO attendees are welcome.

OMAC Members Exhibiting at PACK EXPO Las Vegas
ABB (C-5242)
B&R Industrial Automation (S-6163)
Beckhoff Automation LLC (S-6302)
Bosch Rexroth Group (C-5206)
Festo (C-5408)
Fox IV (S-6301)
GEA (C-5404)
Harro Höfliger (N-317-D)
KEBA AG (S-5908)
KEB America (S-6282)
Lenze Automation GmbH (S-6033)
Mettler Toledo (C-1814, N-306)
Omron Electronics LLC (C-4305)
PakTech (S-1509)
Pro Mach Inc. (C-3218, C-3225)
Robert Bosch GmbH (C-2800)
Rockwell Automation (N-116
Schneider Electric NA (S-6092, S-6167)
SEW Eurodrive (S-6182)
Siemens Industry, Inc. (C-5911)
SMC (S-6169)

Partner Organizations
OPC Foundation (C-1243)
OpX Leadership Network (S-6519)
PLCopen (C-1244)

About OMAC
The Organization for Machine Automation and Control (OMAC) helps manufacturers and suppliers work together to identify new and innovative ways to increase the effectiveness of their production operations. OMAC brings together leading End-User Manufacturers, OEM Machine Builders, System Integrators, Technology Providers, and Non-Profit / Government Agency organizations to address issues that confront global manufacturing today. OMAC’s two working groups, Packaging and Manufacturing, lead the way in producing industry consensus guidelines that help manufacturers reduce their delivery times, be more efficient with available resources, and increase profitability.  More information is available at www.omac.org.

OMAC and OPC UA Companion Specification featured in Packaging World Article

At a recent meeting in Microsoft’s Copenhagen offices, more than 120 controls and automation professionals gathered to seek out ways of better aligning PackML and OPC UA in an OMAC conference called Smart Packaging Automation with PackML & OPC UA.

The goal of the Copenhagen conference was to share information on how the PackML unit/machine Implementation Guidelines from OMAC can reduce time and costs of integration of equipment. Through live implementations and user stories, attendees learned how PackML can be used as a standard interface to facilitate optimal integration between machines and higher-level supervisory control systems on the factory floor.

Read the entire article from Packaging World.

OMAC Members and STEP Tools Stretch On-Machine Measurement to New Lengths

On July 12, a team led by STEP Tools and OMAC members stretched the digital thread farther than ever before – from design, through manufacture, and into five axis measurement.

The demonstration showed how the digital thread enables more accurate, timely and automated on-machine measurement. The Digital thread connects elements in manufacturing and provides an integrated view throughout the process. The demonstration uses STEP to define a product model, MTConnect to communicate on-machine touch points, and QIF to report metrology results. STEP is supported by nearly every CAD system, and has recently been updated to include tolerances that can be reasoned with by intelligent software. MTConnect is available for nearly every type of machine tool and for this demonstration has been extended to include touch probe results. QIF has been developed by the team responsible for DMIS as a next generation standard for metrology planning and reporting.

Click Here to see video of the Digital Thread demo.