OMAC and SESAM Hold Conference on Smart Packaging Automation Using PackML & OPC UA

March 15 & 16
Copenhagen, Denmark
Microsoft Development Center
Kanalvej 7, 2800 Kongens Lyngby, Denmark

Conference includes examples and presentations of end user PackML and OPC UA implementations. Automation suppliers will exhibit and discuss PackML and OPC UA tools and solutions for OEMs and End User companies.

Cost: 350 Euro for OMAC and SESAM members; 450 Euro for non-members

Registration: www.sesam-world.com/registration-omac

For more information, review the conference brochure.

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